RESEARCH
Ultra-Scale Photonic Control and Measurement Group
RESEARCH
Ultra-Scale Photonic Control and Measurement Group
This research thrust translates the extreme temporal precision of frequency combs into high-impact solutions for semiconductor manufacturing and advanced industrial inspection. We develop ultrafast time-of-flight (TOF) measurement techniques capable of sub-nanometer and even angstrom-scale resolution, enabling non-destructive metrology of complex semiconductor structures such as 3D integrated circuits, through-silicon vias (TSVs), and multilayered photonic devices.
Our approach combines frequency-comb-based sensing with advanced signal processing and machine learning methods, enabling high-precision inspection of complex nanoscale structures that are increasingly difficult to characterize using conventional techniques. Beyond static measurements, we investigate the high-speed dynamics of nanostructures and develop massively parallel imaging approaches for multidimensional metrology. These technologies provide the high-throughput and high-precision sensing capabilities required for next-generation semiconductor fabrication and nano-manufacturing systems.